2019 Fall Annual(165th) Meeting

Session information

General Session

6.Materials Processing » Solid process/ Solid and welding process

[G] Joining, Welding, Soldering, Packaging, Adhesion, Techniques for Forming Composite(2)

Fri. Sep 13, 2019 11:00 AM - 4:20 PM C (D11 at 1st Flr. Building D for General Education)

座長:村上 敬(国立研究開発法人産業技術総合研究所)、荘司 郁夫(群馬大学)、梶原 正憲(東京工業大学)、苅谷 義治(芝浦工業大学)

11:00~ 村上敬
13:00~ 荘司郁夫
14:10~ 梶原正憲
15:20~ 苅谷義治
※表示の講演時間には質疑応答時間も含みます。
(質疑応答時間5分、基調講演と村上記念賞受賞講演は5~10分、技術開発賞は質疑時間なし)

Lunch (12:00 PM - 1:00 PM)

break (2:00 PM - 2:10 PM)

break (3:10 PM - 3:20 PM)

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