[G] Solid process/ Solid and welding process(1)

Wed. Sep 16, 2020 1:00 PM - 3:50 PM Rm. O (ZoomRm.O)

Chair:Tatsuya Kobayashi Sub Chairman (assistant):Tatsuya Kobayashi

13:00~13:30　座長　小林竜也　副座長　苅谷義治
13:30~13:45　座長　苅谷義治　副座長　小林竜也
13:45~14:15　座長　荘司郁夫　副座長　苅谷義治
14:35~15:05　座長　小林竜也　副座長　苅谷義治
15:05~15:20　座長　苅谷義治　副座長　荘司郁夫
15:20~15:50　座長　荘司郁夫　副座長　苅谷義治
※表示の講演時間には質疑応答時間も含みます。
（質疑応答時間5分、基調講演と村上記念賞受賞講演は5～10分）

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1:00 PM - 1:15 PM

[315] Power Cycle Endurance Analysis of die Attach in Power Device Joined by Pressure Sintering using Ag nanoparticles

*Kiichi NAGATA¹, Yoshiharu KARIYA², Akito NISHI³ (1. Graduate School of Shibaura Institute of Technology, 2. Material Science and Engineering Department Shibaura Institute of Technology, 3. Assembly Development Department, Assembly Engineering Division, Engineering Headquarters, Sanken Electric)

1:15 PM - 1:30 PM

[316] Effect of Creep on Thermal Fatigue Fracture Driving Force of Power Device Die Attach Joint Using Ag Nanoparticle Sintering Joint

*Masahiro URABE¹, Yoshiharu KARIYA², Noritsuka MIZUMURA³, Koji SASAKI³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering Shibaura Institute of Technology, 3. NAMICS Corporation)

1:30 PM - 1:45 PM

[317] Power Cycle Damage Behavior of Lead-Free Solder Joints for Power Semiconductor

*Yuta YAMANAKA¹, Ikuo SHOHJI¹, Tatsuya KOBAYASHI¹, Yoshihiro OBATA², Motoki KURASAWA² (1. Graduate School of Science and Technology, Gunma Univ, 2. MARELLI Co., Ltd.)

1:45 PM - 2:00 PM

[318] Crack initiation behavior in Fatigue Crack Networks Formation of Die Attach Joint

*Yoshiki Abe¹, Yoshiharu Kariya², Hiroshige Sugimoto¹, Yoshinori Yokoyama³, Ryuichiro Hanada³, Shinnosuke Soda³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. Advanced Technology R&D Center, Mitsubishi Electric Corporation)

2:00 PM - 2:15 PM

[319] Crack Growth Behavior in Fatigue Crack Networks Formation of Die Attach Joint

*Hiroshige SUGIMOTO¹, Yoshiharu KARIYA², Yoshinori YOKOYAMA³, Ryuichiro HANADA³, Shinnosuke SODA³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. Advanced Technology R&D Center, Mitsubishi Electric Corporation)

break (2:15 PM - 2:35 PM)

2:35 PM - 2:50 PM

[320] Effect of Filler Particle Size Distribution on Fatigue Crack Propagation Driving Force of Epoxy Resin Filled with Spherical Silica

*Hidetoshi HARA¹, KARIYA Yoshiharu², FUJITA Takayuki³, ENOMOTO Toshiaki³, YAMAGUCHI Hiroshi³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. NAMICS Corporation)

2:50 PM - 3:05 PM

[321] Delamination Analysis of Insulation Interlayer Dielectric Film in Semiconductor Package Structure

*kenta ONO¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Material Science and Engineering Department Shibaura Institute of Technology)

3:05 PM - 3:20 PM

[322] Effect of Ni Addition on Fatigue Properties of Sn-Sb-Ag High Temperature Lead Free Solder

*Mizuki Yamamoto¹, Ikuo Shohji¹, Tatsuya Kobayashi¹, Kohei Mitsui², Hirohiko Watanabe² (1. Graduate School of Science and Technology, Gunma Univ., 2. Fuji Electric Co., Ltd.)

3:20 PM - 3:35 PM

[323] Fatigue Life Prediction Method of BGA Package Solder Joint Under Combined Thermal and Vibration Loading Including the Microstructural Coarsening

*Kouichi MOROOKA¹, Yoshibaru KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Material Science and Engineering Department Shibaura Institute of Technology)

3:35 PM - 3:50 PM

[324] Curing Reaction Rate Equation of UV Curing Adhesives Incorporating Film Thickness and UV-Illumination Dependences

*Yuga SATO¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering Shibaura Institute of Technology)

Session information