[G] Solid process/ Solid and welding process(1)

[318] Crack initiation behavior in Fatigue Crack Networks Formation of Die Attach Joint

*Yoshiki Abe¹, Yoshiharu Kariya², Hiroshige Sugimoto¹, Yoshinori Yokoyama³, Ryuichiro Hanada³, Shinnosuke Soda³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. Advanced Technology R&D Center, Mitsubishi Electric Corporation)

Keywords:Fatigue crack network、Die attach、Lead-free solder、Power module

パワーモジュールダイアタッチの疲労き裂ネットワークの寿命予測方法を検討するため，接合体試験片を用いて温度サイクル試験を行い，疲労き裂ネットワークのき裂個数とサイクル数の関係を精査し，定式化を行った．