[G] Solid process/ Solid and welding process(1)

[319] Crack Growth Behavior in Fatigue Crack Networks Formation of Die Attach Joint

*Hiroshige SUGIMOTO¹, Yoshiharu KARIYA², Yoshinori YOKOYAMA³, Ryuichiro HANADA³, Shinnosuke SODA³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. Advanced Technology R&D Center, Mitsubishi Electric Corporation)

Keywords:Fatigue crack network、Die attach、Lead-free solder、Power module

パワーモジュールダイアタッチの疲労き裂ネットワークの寿命予測方法を検討するため，接合体試験片を用いて温度サイクル試験を行い，疲労き裂ネットワークの発達過程をき裂長さとサイクル数の関係から精査した．