[G] Phase Diagrams and Diffusion

[64] Kinetics of the reactive diffusion between solid Cu and liquid Sn-Bi alloys

*Minho O¹, Haruka Fujita¹, Equo Kobayashi¹, Masanori Kajihara¹ (1. Dept. Mater. Sci. Eng., Tokyo Institute of Technology)

Keywords:拡散、固相-液相界面、金属間化合物、粒界拡散、界面反応

The growth behavior of intermetallic compounds at the solid-liquid interface was experimentally observed to examine the reactive diffusion between solid Cu and liquid Sn-Bi alloys.