一般講演

6.Materials Processing » Solid process/ Solid and welding process

[G] Packaging

Fri. Sep 17, 2021 1:00 PM - 5:00 PM Rm. K (ZoomRm.K)

Chair:Hajime Yamamoto(JWRI), Shinji Fukumoto(Osaka University)

※表示の講演時間には質疑応答時間も含みます。
（質疑応答時間5分、基調講演と招待講演は5～10分）

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1:00 PM - 1:15 PM

[250] Interfacial Crack Growth Rate Measurement of Interlayer Dielectric Film on Cu for Redistribution Layer of Semiconductor Package

*Kaiwen ZHONG¹, Yoshiharu KARIYA² (1. Graduate University of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology)

1:15 PM - 1:30 PM

[251] Thermal Fatigue Fracture of Sn-3.0Ag-0.5Cu Solder under Equi-Biaxial Stress

*Yoshiki ABE¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology)

1:30 PM - 1:45 PM

[252] Elastic-Plastic-Creep Simulation of sintered Ag nanoparticles by Separation of Plastic and Creep

*Masahiro URABE¹, Yoshiharu KARIYA², Koji SASAKI³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. NAMICS Corporation)

1:45 PM - 2:00 PM

[253] Effect of Microstructure on Fatigue Crack Propagation Properties of Ag Sintered body

*Sho ISHIHARA¹, Yoshiharu KARIYA², Koji SASAKI³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering Shibaura Institute of Technology, 3. NAMICS Corporation)

break (2:00 PM - 2:30 PM)

2:30 PM - 2:45 PM

[254] Effect of Ni Addition on Fatigue Properties of Sn-Sb-Ag-Ni-Ge Solder Alloy

*mizuki yamamoto¹, ikuo shohji¹, tatsuya kobayashi¹, kohei mitsui², hirohiko watanabe^1,2 (1. Graduate School of Science and Technology, Gunma Univ., 2. Fuji Electric Co., Ltd.)

2:45 PM - 3:00 PM

[255] Power Cycle Damage Behavior of Sn-Sb-Ag-Ni-Ge Solder Joints

*Yuta YAMANAKA¹, Ikuo SHOHJI¹, Tatsuya KOBAYASHI¹, Kohei MITSUI², Hirohiko WATANABE^1,2 (1. Graduate School of Science and Technology, Gunma Univ., 2. Fuji Electronic Co., Ltd.)

3:00 PM - 3:15 PM

[256] Effect of Bi and Sb Edition on Creep and Thermal Fatigue Life of Sn-Ag-Cu Solder Alloy

*Masaki MORIUCHI¹, Yoshiharu KARIYA² (1. Graduate Science and Engineering Department, 2. Material Science and Engineering Department Shibaura Institute of Technology)

3:15 PM - 3:30 PM

[257] Interfacial Reaction between Probe for Semiconductor Packages Inspection and Sn-58Bi Solder

*kazumi watarai¹, Ikuo shohji¹, Tatsuya Kobayashi¹, Tomohisa Hoshino², Kenichi Sato², Shunsuke Kobayashi², Naohito Odani² (1. Graduate School of Science and Technology, Gunma Univ., 2. Yokowo Co., Ltd.)

break (3:30 PM - 4:00 PM)

4:00 PM - 4:15 PM

[258] Effects of Structural Factors on Stress State of Die Attach Joint in Power Semiconductor Device During Power Cycling

*Yuya CHISHIMA¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering Shibaura Institute of Technology)

4:15 PM - 4:30 PM

[259] Delamination Analysis of Stacked Via in High-Density-Multilayer Printed Wiring Boards by FEA

*Moe NOZAKI¹, Yoshiharu KARIYA², Yoshiyuki HIROSHIMA³, Nobuo TAKETOMI³, Kenichi OHASHI⁴, Kenichi TOMIOKA⁴, Shunichi KIKUCHI⁵, Jack TAN⁵ (1. Graduate school of Shibaura Institute of Technology, 2. Department of Material Science and Engineering, Shibaura Institute of Technology, 3. NTT Electronics Cross Technology Corp., 4. Showa Denko Materials Co., Ltd, 5. HDP User Group, Inc)

4:30 PM - 4:45 PM

[260] Evaluation of Fatigue Crack Propagation Characteristics at the Interface between Si Die and Underfill in Real Semiconductor Package Structure

*Hidetoshi HARA¹, Yoshiaharu KARIYA², Takayuki FUJITA³, Toshiaki ENOMOTO³, Hiroshi YAMAGUCHI³, Takuya YOSHIDA³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. NAMICS Corporation)

4:45 PM - 5:00 PM

[261] Reproduction Analysis of Fatigue Crack Networks in Die Attach Joint by FEA

*Hiroki KANAI¹, Yoshiharu KARIYA², Yoshiki ABE¹, Yoshinori YOKOYAMA³, Koki OCHI³, Ryuichiro HANADA³, Shinichi IZUO³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. Advanced Technology R&D Center, Mitsubishi Electric Corporation)

Session information