[G] Melting and solidification process/High temperature process

[219] Influence of Cooling Conditions on Microstructure of Melted Mark on Copper Wire

*Suphattra Sachana¹, Kohei Morishita¹, Hirofumi Miyahara¹ (1. Kyushu University)

Keywords:Copper wire、Copper oxide、Microstructure

A change in the structure of melted marks on the copper wire under cooling conditions is useful to describe fire behaviors in order to identify the origin of the fire accident.