[G] Biomaterials Development and Clinics

[388] Changes of electrical resistivity of copper-based alloy developed via laser beam powder bed fusion

*Mridul GUPTA¹, Ryosuke OZASA², Takuya ISHIMOTO², Tetsuji KUSE³, Akihiko YANAGITANI⁴, Masato UEDA⁵, Takayoshi NAKANO² (1. Osaka Univ., Graduate School of Engineering, 2. Osaka Univ., Graduate School of Engineering, 3. Sanyo Special Steel Co., Ltd., 4. Univ. of Hyogo, Graduate School of Engineering, 5. Kansai Univ. Faculty of Chemistry, Materials and Bioengineering)

Keywords:Additive Manufacturing、銅合金、電気抵抗率

本研究ではCu合金に対し、レーザビーム粉末床溶融結合法における溶融/凝固パラメータを検討することで、低電気抵抗率を示す緻密な造形体の作製を目的とした。