[G] 溶融・凝固プロセス 高温プロセス

[95] Effect of Heat Conditions on Microstructure of Melted Mark on Copper Wire

*Suphattra Sachana¹, Kohei Morishita¹, Hirofumi Miyahara¹ (1. Kyushu University, Graduate School of Engineering, Department of Materials Process Engineering)

キーワード：Copper wire、Heat conditions、Microstructure

The layer oxide appears at the surface of the melted mark that was cooled down in the furnace. The thickness of the oxide layer seems to be valuable to estimate the burning time of the fire accident