[G] Solid process/ Solid and welding process(2)

Thu. Sep 21, 2023 10:00 AM - 12:30 PM Rm. E (2nd Flr. Education and Research Building, School of Engineering)

Chair:Naoyuki HAMADA

※表示の講演時間には質疑応答時間も含みます。
（質疑応答時間5分、基調講演と招待講演は5～10分）

+Add all to schedule

10:00 AM - 10:15 AM

[127] The Effect of Internal Microstructure on Static Mechanical Properties of Ag Sintered Body by 3D Microscale Numerical Material Testings

*Tatsuki OTANI¹, Yoshiharu KARIYA², Koji SASAKI³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering Shibaura Institute of Technology, 3. NAMICS Corporation)

10:15 AM - 10:30 AM

[128] Effect of Internal Structure on Fatigue Crack Propagation Rate of Sintered Ag particles

*Kazuya WASHIDA¹, Yoshiharu KARIYA², Koji SASAKI³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering Shibaura Institute of Technology, 3. NAMICS Corporation)

10:30 AM - 10:45 AM

[129] Effect of Temperature on Fatigue Crack Propagation Rate at the Interface between Si Die and Underfill in Real Semiconductor Package Structures

*Takumi SHINADA¹, Yoshiharu KARIYA², Hiroshi YAMAGUCHI³, Toshiaki ENOMOTO³, Takuya YOSHIDA³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. NAMICS Corporation)

10:45 AM - 11:00 AM

[130] Formation of Three-Dimensional Structure Ni-Cu Alloy Plating and Adhesion to Epoxy Resin

*THAI　ANH PHAM¹, Ikuo Shohji¹, Tatsuya Kobayashi¹ (1. Gundai Rikou)

break (11:00 AM - 11:15 AM)

11:15 AM - 11:30 AM

[131] Fracture Development Simulation of Die Attach Joint Subjected to Equiaxial Thermal Stress

*Saki FUNADERA¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology)

11:30 AM - 11:45 AM

[132] Correlation between Fatigue Crack Network Damage and Thickness in Power Semiconductor Die Attach Joints

*Toshiyuki MISU¹, Yoshiharu KARIYA², Akihisa HUKUMOTO³, Masaki TAYA³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. Advanced Technology R&D Center, Mitsubishi Electric Corporation)

11:45 AM - 12:00 PM

[133] Effect of Ag Addition on Fatigue Properties of Sn-Sb-Ag-Ni-Ge Solder Alloy

*Kentaro Kawai¹, Tatsuya Kobayashi¹, Ikuo Syohji¹, Kohei Mitsui², Hirohiko Watanabe^1,2 (1. Graduate School of Science and Technology, Gunma Univ., 2. Fuji Electric Co., Ltd.)

12:00 PM - 12:15 PM

[134] Investigation of Fatigue Properties of Sn-58Bi Lead-Free Solder for Flip Chip Bonding

*Shota UMEDA¹, Tatsuya KOBAYASHI², Ikuo SHOHJI², Hirokazu NOMA³, Kazue HIRANO³, Hitoshi ONOZEKI³, Sadaaki KATOH³ (1. Graduate School of Science and Technology, Gunma Univ, 2. Graduate School of Science and Technology, Gunma Univ, 3. Resonac Corporation)

12:15 PM - 12:30 PM

[135] Fracture Mechanics Evaluation of Delamination Strength of Interlayer Dielectric Film on Cu for Semiconductor Package Using Virtual Crack Model

*Hironao KAWABE¹, Yoshiharu KARIYA², Makoto HARAGUCHI³, Mitsuka ANDO³, Hirokazu ITO³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. JSR Corporation)

Session information