Solid Phase Bonding of A5052/C1020 by Electrically Assisted Bonding Technique

4:30 PM - 4:45 PM

[412] Solid Phase Bonding of A5052/C1020 by Electrically Assisted Bonding Technique

*Kota NAKAI¹, Shinji KOYAMA¹, Masanori UENO², Masami MOTEGI² (1. Gunma Univ., 2. Sanken electric Co., LTD.)

Keywords:A5052、C1020、固相接合、電気アシスト接合、金属間化合物

アルミニウムと銅の電気アシスト接合における，電子の移動方向および電流値が接合強度に及ぼす影響を調査し，接合強度向上を検討した．

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