[G] Solid process/ Solid and welding process(2)

[131] Fracture Development Simulation of Die Attach Joint Subjected to Equiaxial Thermal Stress

*Saki FUNADERA¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology)

Keywords:die attach joint、equiaxial thermal stress、fracture development simulation、thermal fatigue crack network、life prediction

破壊進行と熱抵抗増加の過程を組み込んだ損傷発展型FEM解析を用いて，パワーサイクル試験におけるダイアタッチ接合部の疲労破壊の再現を試みた．