[G] Solid process/ Solid and welding process(2)

[132] Correlation between Fatigue Crack Network Damage and Thickness in Power Semiconductor Die Attach Joints

*Toshiyuki MISU¹, Yoshiharu KARIYA², Akihisa HUKUMOTO³, Masaki TAYA³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. Advanced Technology R&D Center, Mitsubishi Electric Corporation)

Keywords:Power module、Die attach joint、Life prediction、Thermal fatigue crack network、Solder thickness

ダイアタッチであるはんだ合金に等2軸応力を負荷できるSi / Solder / Si接合体試験片を用いた高速温度サイクル試験を行い，はんだ厚さの違いによる疲労き裂ネットワーク形成の差異を調査した．