[G] Solid process/ Solid and welding process(2)

[135] Fracture Mechanics Evaluation of Delamination Strength of Interlayer Dielectric Film on Cu for Semiconductor Package Using Virtual Crack Model

*Hironao KAWABE¹, Yoshiharu KARIYA², Makoto HARAGUCHI³, Mitsuka ANDO³, Hirokazu ITO³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. JSR Corporation)

Keywords:Critical energy release rate、Delamination、Stress singularity、Shear test、Finite element method

シア試験を用い，この試験結果に対して仮想き裂を導入した有限要素法モデルを用いて破壊力学的な解析を行い，擬似的に剥離靭性値を算出する方法を考案し，その妥当性について検討した．