Effects of Morphological Changes and Creep Properties on Thermal Fatigue Properties of Sn-<em>x</em>Ag-0.5%Cu (<em>x</em>=1, 2, 3 and 4mass%) solder alloys.

Presentation information

一般講演

6.Materials Processing » Solid process/ Solid and welding process

[G] Solid process/ Solid and welding process(2)

Thu. Mar 9, 2023 9:00 AM - 11:45 AM Rm. L (Rm.1312,1st Flr.,Buld.No.13)

座長:伊藤和博(大阪大学)、石本卓也(富山大学)

9:30 AM - 10:00 AM

*Shinichi TERASHIMA¹ (1. Advanced Technology Research Labs., Nippon Steel Corp.)

Keywords:はんだ、熱疲労、クリープ、マイクロ接合、実装

Effects of Morphological Changes and Creep Properties on Thermal Fatigue Properties of Sn-xAg-0.5%Cu (x=1, 2, 3 and 4mass%) solder alloys.

Please log in with your participant account.
» Participant Log In