Development of stacked silicon strip detectors for MeV electron on board the Geospace exploration satellite ``ERG''

Takefumi MITANI; Satoshi KASAHARA; Takeshi TAKASHIMA; Masafumi HIRAHARA; Wataru MIYAKE; Nobuyuki HASEBE

Presentation information

Poster

Symbol P (Space and Planetary Sciences) » P-EM Solar-Terrestrial Sciences, Space Electromagnetism & Space Environment

[P-EM28] Dynamics in magnetosphere and ionosphere

Wed. May 27, 2015 6:15 PM - 7:30 PM Convention Hall (2F)

Convener:*Yoshizumi Miyoshi(Solar-Terrestrial Environement Laboratory, Nagoya University), Hiroshi Hasegawa(Institute of Space and Astronautical Science, Japan Aerospace Exploration Agency), Shin'ya Nakano(The Institute of Statistical Mathematics), Yoshimasa Tanaka(National Institute of Polar Research), Tomoaki Hori(Nagoya University Solar Terrestrial Environment Laboratory Geospace Research Center)

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6:15 PM - 7:30 PM

[PEM28-P08] Development of stacked silicon strip detectors for MeV electron on board the Geospace exploration satellite ``ERG''

*Takefumi MITANI¹, Satoshi KASAHARA¹, Takeshi TAKASHIMA¹, Masafumi HIRAHARA², Wataru MIYAKE³, Nobuyuki HASEBE⁴ (1.ISAS/JAXA, 2.Nagoya University, 3.Tokai University, 4.Waseda University)

Keywords:ERG, silicon semiconductor detector, electron acceleration

The Energization and Radiation in Geospace (ERG) project will explore how relativistic electrons in the radiation belts are generated during space storms. ``High energy particle (electron)'' instrument (HEP-e) on board ERG satellite will measures 3-D distribution of high energy electron between 70 keV and 2 MeV. In high resolution mode, HEP-e measures the energy and incident direction of each electron with time resolution of 2 μsec.
The detection parts of HEP-e are six pinhole cameras which consist of mechanical collimators, silicon semiconductor detectors and readout ASICs. Three camera measure electrons with energy of 70 keV - 1 MeV and other three with energy of 700 keV - 2 MeV.
The flight model of HEP-e is under manufacture and the verification tests before integration are ongoing. In this presentation we introduce HEP-e instrument and report results of the step-by-step verification tests of each component before final assembly.