Japan Geoscience Union Meeting 2022

Presentation information

[J] Oral

S (Solid Earth Sciences ) » S-IT Science of the Earth's Interior & Techtonophysics

[S-IT22] Innovation through the Integration of Solid Earth Science and Materials Science

Mon. May 23, 2022 1:45 PM - 3:15 PM 102 (International Conference Hall, Makuhari Messe)

convener:Kenji Kawai(Department of Earth and Planetary Science, School of Science, University of Tokyo), convener:Jun Tsuchiya(Geodynamics Research Center, Ehime University), Satoshi Ohmura(Hiroshima Institute of Technology), convener:Noriyoshi Tsujino(Institute for Planetary Materials, Okayama University), Chairperson:Kenji Kawai(Department of Earth and Planetary Science, School of Science, University of Tokyo), Jun Tsuchiya(Geodynamics Research Center, Ehime University), Satoshi Ohmura(Hiroshima Institute of Technology), Noriyoshi Tsujino(Institute for Planetary Materials, Okayama University)

2:30 PM - 2:45 PM

[SIT22-03] Molecular dynamics study on plastic deformation of silica and silicate materials

*Masaaki Misawa1, Tsuyoshi Endo1, Kenji Tsuruta1, Fuyuki Shimojo2 (1.Okayama University, 2.Kumamoto University)

Keywords:Molecular dynamics simulation, Structural transformation, Silica and silicate materials

Materials simulations based on classical, first-principles, and machine-learning molecular dynamics methods are considered as a powerful tool for investigating the microscopic atomistic mechanisms of the structural transformation of solid materials, and are applied in a wide range of fields. In the presentation, we will show our several molecular dynamics studies on the plastic deformation behaviors of silica and silicate materials under tensile strain [1], high-pressure [2], shock compression [3], and shear strain and will discuss application of those methodologies to Earth science.

References:
[1] M. Misawa et al., Sci. Adv. 3, e1602339 (2017).
[2] M. Misawa and F. Shimojo, Phys. Status Solidi B-Basic Solid State Phys. 257, 2000173 (2020).
[3] M. Misawa et al., J. Phys. Chem. Lett. 11 4536-4541 (2020).