Japan Geoscience Union Meeting 2023

Session information

[J] Oral

H (Human Geosciences ) » H-CG Complex & General

[H-CG22] Earth surface processes related to deposition, erosion and sediment transport

Mon. May 22, 2023 1:45 PM - 3:00 PM 201B (International Conference Hall, Makuhari Messe)

convener:Koji Seike(Geological Survey of Japan, AIST), Masayuki Ikeda(University of Tokyo), Kazuki Kikuchi(Division of Earth and Planetary Sciences, Guraduate School of Science, Kyoto University), Hideko Takayanagi(Institute of Geology and Paleontology, Graduate School of Science, Tohoku University), Chairperson:Masayuki Ikeda(University of Tokyo), Kazuki Kikuchi(Division of Earth and Planetary Sciences, Guraduate School of Science, Kyoto University), Koji Seike(Geological Survey of Japan, AIST)

To understand landscape evolution and dynamics of erosion, transport and sedimentation of earth-surface materials, the latest results of multiple research fields including engineering and earth sciences will be presented. As well as any researches of sedimentology and sedimentary petrology, interaction between fluid, sediments and geomorphology is focused. Interdisciplinary discussions of science, disaster prevention and resource exploration will be expected.

2:15 PM - 2:30 PM

*Hisatoshi Baba1, Nagisa Nakao2, Izumi Sakamoto1, Shintaro Abe3, Takashi OGAMI4, Yuka Yokoyama1, Nozomi Nakamura5, Satoshi Watanabe6, Shigeo Matsuda7, Asahiko Taira8 (1.Department of Marine and Ocean Engineering, Tokai University, 2.Graduate School of Science and Technology, Course of Science and Technology, Tokai University, 3.Association for the Development of Earthquake Prediction, 4.National Institute of Advanced Industrial Science and Technology, 5.Graduate School of Oceanography, Tokai University, 6.Department of Marine and Science, Tokai University, 7.Clovertech Co., Ltd., 8.Institute of Oceanic Research and Development, Tokai Univiersity)

×

Authentication

Abstrat will be released on May 12th. Password authentication is not possible. Please wait until the publication date.

×

Please log in with your participant account.
» Participant Log In
» Click here for Exhibitor Log In