*Takero Yoshihisa1, Takaaki Yokoyama1, Takafumi Kanko2
(1.Kyoto University, 2.LMSAL, HAO/NCAR)
Keywords:sun, prominences, coronal heating
Solar prominences are relatively dense and cool plasmas in the corona. Study on their formation mechanisms and growth process are important from the viewpoint of the coronal heating problem. The sudden appearance of prominences in the corona suggests that coronal plasmas condense for some reason. One of the most promising models is the Evaporation-Condensation model. In this model, a loop which has a dip at its center becomes the thermal non-equilibrium state by the footpoint-concentrating localized heating. Then, elevated plasmas by the chromospheric evaporation are accumulated at the dip causing an increase of density and a runaway cooling resulting in the prominence formation. The sudden change in density and temperature influence on the heating behavior. Therefore, to understand the thermal evolution during prominence formations, it is important to consider not only a cooling but also a dependence of coronal heating mechanisms on physical variables and their temporal change. However, in almost all previous studies, they incorporated the heating term in an ad hoc manners. Therefore, in our study, we tackled this formation problem with a 1.5D MHD simulation considering two energy dissipation mechanisms by the shock and Alfven wave turbulence (AWT) by refering to studies on the coronal heating problem. In this simulation, we prepare a dipped magnetic field line and add the footpoint-concentrating localized heating to reproduce prominences. We found that (1) the AWT heating become enhanced when the prominence approaches footpoints of the loop, and that (2) after the prominence formation, the temperature of the remnant coronal loop become lower than coronal temperature before the formation. And, as in the previous studies, we confirmed that (3) passages and collisions of shocks trigger the condensation, and that (4) prominence mass increases even after ceasing the localized heating.