[27p-F1-1~14] 6.5 Surface physics and vacuum

[27p-F1-14] The effect of addition of O₂ to filling Cu into the Co film trench by using high vacuum sputtering

^○Hiroyuki Iida¹, Masatoshi Itoh¹, Shigeru Saito¹ (Tokyo Univ. of Science¹)

Keywords:Cu埋め込み、マグネトロンスパッタリング、酸素添加