The 75th JSAP Autumn Meeting, 2014

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Poster presentation

13. Semiconductors A (Silicon) » 13.3 Si Process・Interconnect・MEMS・Integration

[17p-PA1-1~16] 13.3 Si Process・Interconnect・MEMS・Integration

Wed. Sep 17, 2014 1:30 PM - 3:30 PM PA1 (Gymnasium1)

ポスター掲示時間13:30～15:30(PA1会場)

1:30 PM - 3:30 PM

[17p-PA1-16] Study on suppression of Cu diffusion using carbon

○Raed Alsubaie1, Makoto Yamashita1, Kazuyoshi Ueno1 (SIT1)

Keywords:Cu拡散,バリア膜,配線材料