The 75th JSAP Autumn Meeting, 2014

Presentation information

Poster presentation

13. Semiconductors A (Silicon) » 13.3 Si Process・Interconnect・MEMS・Integration

[17p-PA1-1~16] 13.3 Si Process・Interconnect・MEMS・Integration

Wed. Sep 17, 2014 1:30 PM - 3:30 PM PA1 (Gymnasium1)

ポスター掲示時間13:30~15:30(PA1会場)

1:30 PM - 3:30 PM

[17p-PA1-7] Microfluidic Device Having Thermocouples on Sidewall

○(B)Masahiro Shibata1, Takahiro Yamaguchi1, Shinya Kumagai1, Minoru Sasaki1 (Toyota Technological Inst.1)

Keywords:熱電対,マイクロ流路,壁面