The 75th JSAP Autumn Meeting, 2014

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Oral presentation

13. Semiconductors A (Silicon) » 13.3 Si Process・Interconnect・MEMS・Integration

[18a-A19-1~13] 13.3 Si Process・Interconnect・MEMS・Integration

Thu. Sep 18, 2014 9:00 AM - 12:30 PM A19 (E311)

11:30 AM - 11:45 AM

[18a-A19-10] Investigation on Room temperature Bonding Mechanism of Compliant Bump with Ultrasonic Assist

○Keiichiro Iwanabe1, Takanori Shuto1, Ryo Takigawa1, Tanemasa Asano1 (Kyushu Univ.1)

Keywords:先鋭バンプ