[19p-C4-1~10] 18.3 Laser Manufacturing

[19p-C4-10] Crack formations inside a LiF single crystal by focusing a femtosecond laser pulse with controlled astigmatism

^〇Sakakura Masaaki¹,Fujimatsu Yusei²,Fukuda Naoaki¹,Shimotsuma Yasuhiko²,Miura Kiyotaka² (SACI, Kyoto Univ.¹,Grad. Sch. Eng, Kyoto Univ.²)

キーワード：laser dicing,crystal,crack