The 75th JSAP Autumn Meeting, 2014

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Oral presentation

08. Plasma Electronics » 8.4 Plasma etching

[19p-S10-1~18] 8.4 Plasma etching

Fri. Sep 19, 2014 2:15 PM - 7:00 PM S10 (S10)

5:00 PM - 5:15 PM

△ [19p-S10-11] Plasma process damage induced by HBr/O2 plasma with Cl2 gas

○Koji Kanomaru1, Yasuhiro Nojiri1, Seiji Onoue1, Tadashi Shimmura1 (Corporate Munufacturing Engineering Center, Toshiba Corp.1)

Keywords:プラズマ誘起ダメージ