A Method for Evaluation of Adhesion Strength of Structures on Actual Chip

Presentation information

Oral presentation

14. Semiconductors B (Exploratory Materials, Physical Properties, Devices) » 14.1 Physical properties of exploratory materials

Sat. Sep 20, 2014 9:00 AM - 11:45 AM A27 (N302)

11:30 AM - 11:45 AM

^○Tetsu Negishi¹, Mamoru Terai¹, Takashi Nishimura¹ (Mitsubishi Electric Corp.¹)

Keywords:密着強度