[20a-PA2-1~11] 13.1 Basic Properties, Surface and Interface Phenomena, and Simulation

△ [20a-PA2-9] Formation mechanism of nanostructures formed in voids during thermal decomposition of SiO〈sub〉2〈/sub〉 layer

^○Shoudai Osanai¹, Taichi Yoshida¹, Yoshiharu Enta¹ (Hirosaki Univ.¹)

Keywords:シリコン酸化膜,熱分解,ボイド