2:00 PM - 2:15 PM
△ [14p-1C-4] Investigation of Local Bending Stress in 3DIC Using Retention Time Characteristics of DRAM Cell Array
Keywords:3DIC,DRAM
Oral presentation
13 Semiconductors » 13.4 Si wafer processing /MEMS/Integration technology
Mon. Sep 14, 2015 1:15 PM - 5:30 PM 1C (135)
座長:中村 友二(富士通研),筑根 敦弘(大陽日酸)
2:00 PM - 2:15 PM
Keywords:3DIC,DRAM