[14p-1C-1~16] 13.4 Si wafer processing /MEMS/Integration technology

△ [14p-1C-4] Investigation of Local Bending Stress in 3DIC Using Retention Time Characteristics of DRAM Cell Array

〇SEIYA TANIKAWA¹, HISASHI KINO², TAKAFUMI FUKUSHIMA¹, KOYANAGI MITSUMASA³, TETSU TANAKA^1,4 (1.Dept. of Bioengineering and Robotics, Tohoku Univ., 2.FRIS, Tohoku Univ., 3.NIChe, Tohoku Univ., 4.Dept. of Biomedical Engineering, Tohoku Univ.)

Keywords:3DIC,DRAM