3:45 PM - 4:00 PM
[14p-2Q-8] Bridging the gap between the nanometer-scale bottom-up and micrometer-scale top-down approaches through a self-assembly process
Keywords:semiconductor,nanowire,self-assembly
This work presents a method that bridges the gap between the nanometer-scale bottom-up and micrometer-scale top-down approaches for site-defined InP/InAs heterostructure NWs, which has long been a significant challenge for applications that require low-cost and high-throughput manufacturing processes.