The 76th JSAP Autumn Meeting, 2015

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Oral presentation

11 Superconductivity » 11.4 Analog applications and their related technologies

[14p-4A-1~26] 11.4 Analog applications and their related technologies

Mon. Sep 14, 2015 12:45 PM - 8:00 PM 4A (431-1)

座長:堺 健司(岡山大),宮戸 祐治(阪大),山下 太郎(NICT),浮辺 雅宏(産総研)

6:45 PM - 7:00 PM

[14p-4A-22] Fabrication and Characterization of Through Si Via for Embedded STJ

〇Kohei Morita1, Isao Matsumoto1, Masato Naruse1, Hiroaki Myoren1, Masahiro Aoyagi2, Tohru Taino1 (1.Graduate school of Saitama Univ., 2.AIST)

Keywords:Superconducting Tunnel Junction,Through electrode