[14p-PA4-1~9] 3.15 Silicon photonics

[14p-PA4-4] Investigation of patterning effect of III-V-OI wafers on void reduction

〇Seiya Takashima^1,2, Yuki Ikku^1,2, Mitsuru Takenaka^1,2, Shinichi Takagi^1,2 (1.The Univ. of Tokyo, 2.JST-CREST)

Keywords:III-V-OI,Wafer Bonding,Voids