[15a-PB4-1~9] 13.4 Si wafer processing /MEMS/Integration technology

[15a-PB4-3] An Evaluation on Adhesion Strength with Metal Structure for MEMS Accelerometer

〇TERUAKI SAFU¹, Toshifumi Konishi¹, Takaaki Matsushima¹, Daisuke Yamane^2,4, Hiroshi Toshiyoshi^3,4, Masato Sone^2,4, Kazuya Masu^2,4, Katsuyuki Machida^1,2,4 (1.NTT-AT Corp, 2.Tokyo Tech, 3.The Univ. of Tokyo, 4.JST-CREST)

Keywords:MEMS,accelerometer

We study on the integrated MEMS accelerometer with multi-layered metal by using gold electroplating for high resolution and wide detection range. Mechanical components of MEMS accelerometer consist of the proof mass, suspensions, electrode, and stopper. We proposed the stopper structure to avoid the self-destruction by over-swinging. In this work, we investigated the mechanical strength of the stopper on the view point of sticking force of metal layers. Experimental results showed that our proposed stopper had a possibility to be over 100 G input acceleration.