The 76th JSAP Autumn Meeting, 2015

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Poster presentation

13 Semiconductors » 13.4 Si wafer processing /MEMS/Integration technology

[15a-PB4-1~9] 13.4 Si wafer processing /MEMS/Integration technology

Tue. Sep 15, 2015 9:30 AM - 11:30 AM PB4 (Shirotori Hall)

9:30 AM - 11:30 AM

[15a-PB4-5] Cu film deposited by super critical CO2 method to Pd barrier layer formedwith high vacuum spattering

〇kei nisikawa1, Yoshio Uhara1, Masatoshi Itho1, Sigeru Saito1 (1.Tokyo Univ. of Science)

Keywords:Super critical fluid,Copper deposition,High vacuum spattering