11:00 AM - 11:15 AM
▲ [16a-2H-9] Annealing effects of the sulfur treated n-type and p-type cuprous oxide
Keywords:cuprous oxide,passivation,annealing
Cu2O semiconductors have several interesting properties to be used in solid state device applications. The high resistivity and defects of Cu2O have hindered the reliability and performance of resulting Cu2O based devices and, there are hardly any reports on their practical applications due to the difficulty in controlling the electrical and optical properties of them. For device applications, understanding surface behavior is also important, because surface passivation is a crucial processing step in the fabrication of electronic and optoelectronic devices. Our recent work demonstrates that the passivation of electrodeposited p-Cu2O and n-Cu2O thin films using ammonium sulfide which lowers the resistivity while increasing photoactivity. In this study, the n-type and p-type cuprous oxide films were electrodeposited potentiostaticaly on Ti substrate in acetate and lactate baths respectively. For surface passivation of the deposited Cu2O films, the film surfaces were exposed to ammonium sulfide gas. All Cu2O thin films were investigated in a three electrode photoelectrochemical cell containing a 0.1 M sodium acetate solution, in order to make the photoresponse measurements. After sulfur passivation, Cu2O films were annealed in air at 100 °C, 150 °C 200 °C , 250 °C, 350 °C and 450 °C. Optimum annealing temperature for highest photocurrent was found to be 200 oC for both n-type and p-type Cu2O on Ti substrate. Optimum results revealed that the annealing of Cu2O samples improves the peak photocurrent performance compared to that of unannealed samples by about a two fold and eight fold for sulfur treated n-type Cu2O and p-type Cu2O films respectively. The influence of sulfur and the annealing on the Cu2O structure was examined using High energy X-ray diffraction measurement at SPring-8. The analysis revealed that the procedure of sulfur treatment itself creates CuxS in crystalline form on the Cu2O film reducing surface defects and shows a significant thermal stability against formation of CuO.