The 76th JSAP Autumn Meeting, 2015

Presentation information

Oral presentation

1 Interdisciplinary Physics and Related Areas of Science and Technology » 1.3 Novel technologies and interdisciplinary engineering

[16a-2K-1~12] 1.3 Novel technologies and interdisciplinary engineering

Wed. Sep 16, 2015 9:00 AM - 12:15 PM 2K (225)

座長:松谷 晃宏(東工大)

9:30 AM - 9:45 AM

[16a-2K-3] Fabrication of Porous Electrode Wiring and Plating for Lowering the Resistance

〇HIDEO TOKUHISA1, SHIHO TSUKAMOTO1, NAOKI SHIRAKAWA1 (1.AIST FLEC)

Keywords:copper,electrode wiring,low resistance

In this study, in order to fabricate a low resistant electrode wiring with almost the same size as the printed pattern, we attempted to form a porous electrode wiring so that a plating solution can penetrate into the inside of the printed wiring and lower the resistance by filling the voids.