The 76th JSAP Autumn Meeting, 2015

Presentation information

Oral presentation

13 Semiconductors » 13.8 Compound and power electron devices and process technology

[16a-4C-1~11] 13.8 Compound and power electron devices and process technology

Wed. Sep 16, 2015 9:00 AM - 12:00 PM 4C (432)

座長:東脇 正高(NICT)

11:45 AM - 12:00 PM

[16a-4C-11] AlGaN/GaN HEMT Properties on 200mm Si Wafer by Fast Rotating Single-Wafer MOCVD

〇Kiyotaka Miyano1, Yasushi Iyechika1, Hideshi Takahashi1, Yusuke Sato1, Shinichi Mitani1 (1.Nuflare Technology)

Keywords:Nitride semiconductor,MOCVD,HEMT

AlGaN/GaN HEMT properties on 200mm Si wafer by Fast Rotating Single-Wafer MOCVD were reported. The crystallinity of 5μm-thick crack-free GaN on Si was evaluated using XRC. FWHM of GaN(002) and (102) were about 250 and 300 arcsec, respectively. The uniformity of Al fraction in barrier AlGaN was ±0.6%. The electron mobility of HEMT was about 2000cm2/V-s. Newly developed fast rotating single-wafer MOCVD is promissing tool for next generation power devices.