9:30 AM - 11:30 AM
[16a-PA2-38] Large Single Layer Etching of 2D Layered Material using Inward-Plasma
Keywords:2D layered material,plasma etching
We tried to etch the surface of molybdenum disulfide, which is one of possible candidates for the next-generation nanoelectronic devices, in layer-by-layer manner by using inward plasma. Etched surfaces were characterized using scanning tunnel microscope. Many concentric circles were observed with the step height of ~ 0.6 nm which corresponds to the thickness of one layer of MoS2. The largest width/depth ratio is about 1000, indicating that the etching proceeds in a nearly layer-by-layer manner at the early stage.