Oral presentation

13 Semiconductors » 13.4 Si wafer processing /MEMS/Integration technology

[11p-A29-1~13] 13.4 Si wafer processing /MEMS/Integration technology

Wed. Mar 11, 2015 2:00 PM - 5:30 PM A29 (6A-204)

△：Young Scientist Oral Presentation Award Applied
▲：English Presentation
▼：Both Award Applied and English Presentation

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2:00 PM - 2:15 PM

△ [11p-A29-1] Tactile, Friction, and Temperature Sensor Array for Artificial Electronic Skin

〇Shingo Harada¹, Kenichiro Kanao¹, Yuki Yamamoto¹, Takayuki Arie¹, Seiji Akita¹, Kuniharu Takei¹ (1.Osaka Pref. Univ.)

2:15 PM - 2:30 PM

△ [11p-A29-2] Electronic Skin with high selectivity against a bending of a substrate

〇Kenichiro Kanao¹, Shingo Harada¹, Yuki Yamamoto¹, Wataru Honda¹, Takayuki Arie¹, Seiji Akita¹, Kuniharu Takei¹ (1.Osaka Pref. Univ.)

2:30 PM - 2:45 PM

[11p-A29-3] Fabrication of MEMS Fabry-Perot interferometric surface-stress sensor with microfluidic channel

〇Yoshihiro Masuya¹, Ryo Ozawa¹, Makoto Ishida¹, Kazuaki Sawada^1,², Kazuhiro Takahashi^1,² (1.Toyohashi Univ. of Tech, 2.JST-CREST)

2:45 PM - 3:00 PM

[11p-A29-4] Fabrication of MEMS resonant sensor using ring-shape PZT electrode

〇Kazuhiro Takahashi^1,², Makoto Ishida¹, Kazuaki Sawada^1,² (1.Toyohashi Tech., 2.JST-CREST)

3:00 PM - 3:15 PM

[11p-A29-5] A Study on an Energy Harvesting Device (5)

〇Toshifumi Konishi¹, Daisuke Yamane², Takaaki Matsushima¹, Kazuya Masu², Hiroshi Toshiyoshi³, Katsuyuki Machida^1,² (1.NTT-AT, 2.Tokyo Tech, 3.The Univ. of Tokyo)

3:15 PM - 3:30 PM

[11p-A29-6] Optical Response of Micromechanical Infrared Thermal Detector

〇(PC)Jonghyeon Jeong¹, Shinya Kumagai^1,³, Ichiro Yamashita^2,³, Yukiharu Uraoka^2,³, Minoru Sasaki^1,³ (1.Toyota Technological Institute, 2.Nara Institute of Science and Technology, 3.CREST JST)

Break (3:30 PM - 3:45 PM)

3:45 PM - 4:00 PM

△ [11p-A29-7] PDMS-made Bacteria Trapping Chip Using Beads III -Time Dependence of Fluorescence Intensity for Various Bacteria-

〇Yusuke Nishimura¹, Ryuhei Hayashi¹, Hirokazu Nakazawa¹, Makoto Ishida¹, Kazuaki Sawada¹, Hiromu Ishii¹, Katsuyuki Machida^2,³, Kazuyuki Masu², Changle Wang⁴, Ken-ichiro Iida⁴, Mitsumasa Saito⁴, Shinichi Yoshida⁴ (1.Toyohashi Univ. of Technology, 2.Tokyo Inst. of Technology, 3.NTT-AT, 4.Graduate School of Medical Sciences, Kyusyu Univ,.)

4:00 PM - 4:15 PM

▲ [11p-A29-8] Two-Dimensional Redox Imaging Employing Integrated Square Wave Voltammetric Pulse Generator Circuit

〇(P)BYOUNGHYUN LIM¹, Sou Takahashi¹, Masato Futagawa², Fumihiro Dasai^1,³, Makoto Ishida¹, Kazuaki Sawada^1,³ (1.Toyohashi Univ. of Tech., 2.Shizuoka Univ., 3.CREST)

4:15 PM - 4:30 PM

[11p-A29-9] Textile Electrode for Wearable Breathing Sensor Based on Capacitance Detection

Makie Terasawa¹, Shinya Kumagai¹, 〇Minoru Sasaki¹ (1.Toyota Tech. Inst.)

4:30 PM - 4:45 PM

[11p-A29-10] Thermal management technique using spectrally selective thermal radiation for electronic devices in small spaces

〇Shinichiro Tsuda¹, Shimizu Makoto¹, Iguchi Fumitada¹, Yugami Hiroo¹ (1.Tohoku Univ.)

4:45 PM - 5:00 PM

[11p-A29-11] Three-dimensional Structure Formation of Porous Silicon by Pyrogenic Oxidation

〇Masaki Denokami¹, Keita Ishiguro¹, Kanna Aoki¹, Minoru Fujii¹ (1.Kobe Univ.)

5:00 PM - 5:15 PM

[11p-A29-12] Wafer-level Hermetic Bonding using Gold Bumps Planarized by Fly Cutting

〇Hideki Hirano¹, Kosuke Hikichi¹, Shuji Tanaka¹ (1.Tohoku Univ.)

5:15 PM - 5:30 PM

[11p-A29-13] Development of a Water Film Chuck for High Precision Thin Grinding

〇Kenichiro Yoshitomi¹, Atsunobu Une¹, Masaaki Mochida¹, Banto Tsubasa², Eiichi Yamamoto² (1.NDA, 2.Okamoto machine tool works)

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