The 62nd JSAP Spring Meeting, 2015

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13 Semiconductors » 13.4 Si wafer processing /MEMS/Integration technology

[11a-A29-1~13] 13.4 Si wafer processing /MEMS/Integration technology

Wed. Mar 11, 2015 9:00 AM - 12:30 PM A29 (6A-204)

12:00 PM - 12:15 PM

[11a-A29-12] Minimal Die Bonding Process

〇Koyu Hochi1, Fumito Imura1, Kiyoharu Miyamoto1, 2, Sommawan Khumpuang1, 3, Shiro Hara1, 3 (1.MINIMAL, 2.IKK, 3.AIST)

Keywords:MINIMAL