[11a-A29-1~13] 13.4 Si wafer processing /MEMS/Integration technology

△ [11a-A29-4] Printing deposition of thin Cu films using nanosilicon ballistic electron emtter

〇Ryutaro Suda¹, Mamiko Yagi¹, Akira Kojima¹, Romain Mentek¹, Jun-ichi Shirakashi¹, Nobuyoshi Koshida¹ (1.Tokyo Univ. of Agri. & Technol.)

Keywords:electron emitter,thin film deposition,reduction