Electronic Skin with high selectivity against a bending of a substrate

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /MEMS/Integration technology

Wed. Mar 11, 2015 2:00 PM - 5:30 PM A29 (6A-204)

2:15 PM - 2:30 PM

〇Kenichiro Kanao¹, Shingo Harada¹, Yuki Yamamoto¹, Wataru Honda¹, Takayuki Arie¹, Seiji Akita¹, Kuniharu Takei¹ (1.Osaka Pref. Univ.)

Keywords:Electronic Skin