The 62nd JSAP Spring Meeting, 2015

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12 Organic Molecules and Bioelectronics » 12.7 Biomedical Engineering and Biochips

[11p-D6-1~18] 12.7 Biomedical Engineering and Biochips

Wed. Mar 11, 2015 1:15 PM - 6:00 PM D6 (16-206)

3:15 PM - 3:30 PM

[11p-D6-9] Flip chip bonding technique on flexible film for fully-implantable neural interface devices

〇Prabhath Horagodage1, Kenji Okabe1, Ippei Akita1, Shota Yamagiwa1, Takeshi Kawano1, Makoto Ishida1 (1.Toyohashi Univ.)

Keywords:flexible,flip chip bonding,packaging