[12a-A18-1~13] 16.3 Bulk, thin-film and other silicon-based solar cells

[12a-A18-5] Surface Investigation of Single Silicon Wafers Cut with Fixed-diamond Multi-wire Saw

〇TETSUO FUKUDA¹, NOBUTAKA SUZUKI¹, MASAAKI MORIYA¹, KATSUHIKO SHIRASAWA¹, HIDETAKA TAKATO¹ (1.AIST)

Keywords:silicon wafer,multi-wire saw,surface