The 62nd JSAP Spring Meeting, 2015

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9 Applied Materials Science » 9.4 Thermoelectric conversion

[12a-A22-1~13] 9.4 Thermoelectric conversion

Thu. Mar 12, 2015 9:00 AM - 12:30 PM A22 (6A-214)

10:45 AM - 11:00 AM

[12a-A22-7] Seebeck coefficient of p-type GOI layers fabricated by wafer bonding technique

〇Hiroya Ikeda1, Veerappan Manimuthu1, Muthusamy Omprakash1, Yuhei Suzuki1, Faiz Salleh1, Mukannan Arivanandhan1, Yoshinari Kamakura2, Yasuhiro Hayakawa1 (1.Shizuoka Univ., 2.Osaka Univ.)

Keywords:Seebeck coefficient