Bonding interface characteristics of directly-bonded InP/Si substrate

Presentation information

Oral presentation

3 Optics and Photonics » 3.13 Semiconductor optical devices

Thu. Mar 12, 2015 2:00 PM - 7:00 PM A17 (6A-207)

5:15 PM - 5:30 PM

〇(M1)Junya Kishikawa¹, Keiichi Matsumoto¹, Yoshinori Kanaya¹, Kazuhiko Shimomura¹ (1.Sophia Univ.)

Keywords:MOVPE,Direct Bonding,Integration technique