The 62nd JSAP Spring Meeting, 2015

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Oral presentation

11 Superconductivity » 11.4 Analog applications and their related technologies

[12p-A3-1~11] 11.4 Analog applications and their related technologies

Thu. Mar 12, 2015 2:00 PM - 5:00 PM A3 (6A-107)

4:45 PM - 5:00 PM

[12p-A3-11] Numerical analysis of thermal stress in a voltage standard chip.

〇Hirotake Yamamori1, Takahiro Yamada1, Hitoshi Sasaki1, hikari Takahashi1, 2, Michitaka Maruyama1, Yasutaka Amagai1, Nobuhisa Kaneko1, Satoshi Kohjiro1, Shogo Kiryu2 (1.AIST, 2.Tokyo City Univ.)

Keywords:Voltage standard,thermal stress