EDX analysis on sidewall surface of Si etched by Deep-RIE Process

Presentation information

Poster presentation

1 Interdisciplinary Physics and Related Areas of Science and Technology » 1.3 Novel technologies and interdisciplinary engineering

Thu. Mar 12, 2015 1:30 PM - 3:30 PM P2 (Gymnasium)

1:30 PM - 3:30 PM

〇Mina Sato¹, Kunio Nishioka¹, Dai Shoji¹, Akihiro Matsutani¹ (1.Semiconductor and MEMS Processing Center, Tokyo Tech)

Keywords:Deep-RIE