The 62nd JSAP Spring Meeting, 2015

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Oral presentation

3 Optics and Photonics » 3.7 Laser processing

[13a-A11-1~11] 3.7 Laser processing

Fri. Mar 13, 2015 9:30 AM - 12:30 PM A11 (6A-116)

12:15 PM - 12:30 PM

[13a-A11-11] Soldering of Quad Flat Package IC Using A Laser Beam Scanning System

〇(D)Hitoshi Tsuchiya1, 2, Tetsuya Homma1 (1.Shibaura Inst. of Tech., 2.Toshiba Corp. Mfg. Eng. Ctr.)

Keywords:Laser soldering,Quad Flat Package IC