The 62nd JSAP Spring Meeting, 2015

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13 Semiconductors » 13.4 Si wafer processing /MEMS/Integration technology

[14a-A29-1~11] 13.4 Si wafer processing /MEMS/Integration technology

Sat. Mar 14, 2015 9:00 AM - 12:00 PM A29 (6A-204)

9:00 AM - 9:15 AM

[14a-A29-1] Formation of Ultrathin SOI Layers with a Uniform Thickness by Photoetching

〇Yuki Miyata1, Yasunori Nakamukai1, Cassia Tiemi Azevedo1, Yasushi Osikane1, Kentaro Kawai1, Kenta Arima1, Mizuho Morita1 (1.Osaka Univ.)

Keywords:SOI,etching